Materials
100% global share in a chemical that enhances chip package adhesiveness - MEC is certain to benefit from the coming capacity expansion in chip production. The surface area that these chemicals go on will increase with new chip stacking architecture. These updated chip packages will also increasingly use MEC’s newer generation chemical, thus improving sales mix. The fact that package maker IBIDEN predicts sales to double by 2026 further supports the positive outlook.
Edition: 124
- 26 November, 2021