Thu 24 Sep 2026 - 15:00 GMT / 10:00 EST / 16:00 CET

• An update across the tracker suite: AI, GPU/ASIC Projects, Compute, Analog and Consumer.

• Rubin packaging yields, and what the ramp timing does to 2027 wafer bookings.

• Custom ASICs continuing to take advanced packaging allocation away from GPUs.

• Co-packaged optics, where our supply chain work puts the production timeline and what carries the traffic until it arrives.

• Memory availability rationing builds outside AI, into phones, notebooks and surveillance.

• Analog demand picking up on a narrow front while lead times keep stretching.

• Asia supply chain update from the ground. I am in Taiwan through early October, SEMICON Taiwan included.